Articles Tagged: foldable smartphones

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Summary

Micron's latest announcement brings significant advancements to mobile storage. The company has introduced world-first G9-based UFS 4.1 and UFS 3.1 storage solutions, which promise substantial improvements in power efficiency and read/write speed.

This enables more on-device AI features to be implemented in smartphones.These new storage chips are designed for ultra-thin and foldable devices, supporting capacities ranging from 256GB to 1TB. The transition to these G9-based chips is expected to occur shortly after Micron's LPDDR5X chips, which will become available in early 2026.The integration of such advanced hardware could significantly impact smartphone design and user experience.

Today Micron announced the world's first G9-based UFS 4.1 and UFS 3.1 storage solutions for smartphones, enabling more on-device AI features. The new storage chips will be available on flagship produ...

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